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SAC305 Low-Void Solder Paste

Model: SP601T4i-8.9HFI(JL) / SAC305 / T4

SAC305 Low-Void Solder Paste

Universal SAC305 lead-free solder paste with ultra-low void rate, ideal for high-precision SMT assembly and high-reliability applications.

Technical Specifications

Low Void · Universal

Model SP601T4i-8.9HFI(JL)
Alloy SAC305 (Sn96.5-Ag3.0-Cu0.5)
Melting Point 217-220°C
Metal Content 88.5%
Powder Size 20-38μm (Type 4)
Flux System No-Clean · Low-Void · Halogen-Free
Certifications RoHS / REACH
Applications Telecom, automotive SMT high-reliability

Key Features

Ultra-low void rate for BGA/CSP high-precision SMT

Excellent printability with 8+ hour stencil life

Strong wetting and solder joint brightness

RoHS, REACH, halogen-free compliant

Ideal for telecom, automotive high-reliability apps

TECHNICAL DATA SHEET

Complete Technical Data

Printing Parameters

Print Speed 25~100 mm/s
Squeegee Pressure 0.020~0.027 kg/mm blade
Solder Paste Roll 20~25 mm
Stencil Life >8 hours (22~28°C / 30~60%RH)
Cleaning Frequency Every 10~25 boards

Storage & Handling

Storage Temp 0~10°C (Refrigerated)
Shelf Life 6 months refrigerated / 1 month room temp
Pre-use Warm-up ≥4 hours (to room temp)
Mixing Time Manual 2~4 min / Machine 1~2 min
Precautions Do not freeze · Do not mix old & new paste

Environmental Compliance

Flux Type ROL0 (IPC J-STD-004B)
Halogen Content None added (EN 14582)
RoHS 2011/65/EU Compliant
REACH SVHC List Compliant

Reliability Tests

Surface Insulation Resistance PASS (IPC J-STD-004B)
Solder Ball Test Acceptable
Slump Test PASS (IPC J-STD-005A)
Spreadability PASS (JIS Z 3197)

Packaging

Standard (500±2) g/jar
Custom Syringe dispensing / other specs upon request
Alloy Customization Other alloys & powder sizes (T3~T5) available

Recommended Reflow Profile

Peak Temperature 235~250°C (SAC Alloy)
Zone Profile Preheat 150~200°C · Soak 200~217°C · Above liquidus 30~60s · Cooling 2~4°C/s
Ramp Rate 1~2°C/s
Cooling Rate 2~4°C/s
Delta-T Control ΔT ≤ ±5°C

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