Home Products High-Temperature Lead-Free Solder Paste

High-Temperature Lead-Free Solder Paste

Model: SP601T4i-8.9HF1 / Sn90Sb10 / T5

High-Temperature Lead-Free Solder Paste

Sn90Sb10 high-temperature alloy, melting point 245~265°C, designed for high-temperature environments and power module soldering.

Technical Specifications

For High-Temperature Applications

Model SP601T4i-8.9HF1
Alloy Sn90-Sb10 (High-Temp Alloy)
Melting Point 245-265°C
Metal Content 80%-90%
Powder Size 15-25μm (Type 5)
Flux System No-Clean · Halogen-Free · Low-Void
Certifications RoHS / REACH
Applications High-temp devices, power module soldering

Key Features

245-265°C high-temperature alloy

Fine Type 5 powder (15-25μm)

Excellent thermal stability and joint strength

No-clean, halogen-free, low-void

Ideal for power modules and high-temp devices

TECHNICAL DATA SHEET

Complete Technical Data

Printing Parameters

Print Speed 25~100 mm/s
Squeegee Pressure 0.020~0.027 kg/mm blade
Solder Paste Roll 20~25 mm
Stencil Life >8 hours (22~28°C / 30~60%RH)
Cleaning Frequency Every 10~25 boards

Storage & Handling

Storage Temp 0~10°C (Refrigerated)
Shelf Life 6 months refrigerated / 1 month room temp
Pre-use Warm-up ≥4 hours (to room temp)
Mixing Time Manual 2~4 min / Machine 1~2 min
Precautions Do not freeze · Do not mix old & new paste

Environmental Compliance

Flux Type ROL0 (IPC J-STD-004B)
Halogen Content None added (EN 14582)
RoHS 2011/65/EU Compliant
REACH SVHC List Compliant

Reliability Tests

Surface Insulation Resistance PASS (IPC J-STD-004B)
SIR (Bellcore) PASS, ≥1.0×10¹¹Ω (96h @65°C/85%RH)
Electromigration PASS (Bellcore GR-78, 500h)
Solder Ball Test Acceptable
Slump Test PASS (IPC J-STD-005A)
Spreadability PASS (JIS Z 3197)

Packaging

Standard (500±2) g/jar
Custom Syringe dispensing / other specs upon request
Alloy Customization Other alloys & powder sizes (T3~T5) available

Recommended Reflow Profile

Peak Temperature 250~270°C (Sn90Sb10 High-Temp Alloy)
Zone Profile Preheat 150~200°C · Soak 200~217°C · Above liquidus 30~60s · Cooling 2~4°C/s
Ramp Rate 1~2°C/s
Cooling Rate 2~4°C/s
Delta-T Control ΔT ≤ ±5°C