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Low-Temperature Lead-Free Solder Paste

Model: SP601T4i-8.9HF1 / Sn64Bi35Ag1 / T4

Low-Temperature Lead-Free Solder Paste

Designed for Sn/Bi and Sn/Bi/Ag low-temperature alloys, melting point 144~179°C, the top choice for heat-sensitive components.

Technical Specifications

Ideal for Heat-Sensitive Components

Model SP601T4i-8.9HF1
Alloy Sn64-Bi35-Ag1 (Low-Temp Alloy)
Melting Point 144-179°C
Metal Content 88.5%
Powder Size 20-38μm (Type 4)
Flux System No-Clean · Halogen-Free · Clear Residue
Certifications RoHS / REACH
Applications LED, heat-sensitive component soldering

Key Features

144-179°C low melting point

Ideal for LED and heat-sensitive components

Compatible with air reflow and nitrogen reflow

Transparent residue, no-clean, halogen-free

Significantly lower energy consumption

TECHNICAL DATA SHEET

Complete Technical Data

Printing Parameters

Print Speed 25~100 mm/s
Squeegee Pressure 0.020~0.027 kg/mm blade
Solder Paste Roll 20~25 mm
Stencil Life >8 hours (22~28°C / 30~60%RH)
Cleaning Frequency Every 10~25 boards

Storage & Handling

Storage Temp 0~10°C (Refrigerated)
Shelf Life 6 months refrigerated / 1 month room temp
Pre-use Warm-up ≥4 hours (to room temp)
Mixing Time Manual 2~4 min / Machine 1~2 min
Precautions Do not freeze · Do not mix old & new paste

Environmental Compliance

Flux Type ROL0 (IPC J-STD-004B)
Halogen Content None added (EN 14582)
RoHS 2011/65/EU Compliant
REACH SVHC List Compliant

Reliability Tests

Surface Insulation Resistance PASS (IPC J-STD-004B)
Solder Ball Test Acceptable
Slump Test PASS (IPC J-STD-005A)
Spreadability PASS (JIS Z 3197)

Packaging

Standard (500±2) g/jar
Custom Syringe dispensing / other specs upon request
Alloy Customization Other alloys & powder sizes (T3~T5) available

Recommended Reflow Profile

Peak Temperature 170~200°C (Sn64Bi35Ag1 Low-Temp Alloy)
Zone Profile Preheat 150~200°C · Soak 200~217°C · Above liquidus 30~60s · Cooling 2~4°C/s
Ramp Rate 1~2°C/s
Cooling Rate 2~4°C/s
Delta-T Control ΔT ≤ ±5°C

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