Home › Products › SAC0307 Lead-Free Solder Paste

SAC0307 Lead-Free Solder Paste

Model: SP601T4i-8.9HF1 / SAC0307 / T4

SAC0307 Lead-Free Solder Paste

SAC0307 low-silver alloy formula balancing cost and performance, with high anti-oxidation and wide process window.

Technical Specifications

Low-Silver Cost-Effective

Model SP601T4i-8.9HF1
Alloy SAC0307 (Sn99-Ag0.3-Cu0.7)
Melting Point 217-227°C
Metal Content 88.5%
Powder Size 20-38μm (Type 4)
Flux System No-Clean · Halogen-Free · Anti-Oxidation
Certifications RoHS / ANSI/J-STD-004/005
Applications Consumer & general industrial electronics

Key Features

Low-silver cost-effective formula

High anti-oxidation performance

Bright solder joints with good spreadability

No-clean, halogen-free

ANSI/J-STD-004/005 compliant

TECHNICAL DATA SHEET

Complete Technical Data

Printing Parameters

Print Speed 25~100 mm/s
Squeegee Pressure 0.020~0.027 kg/mm blade
Solder Paste Roll 20~25 mm
Stencil Life >8 hours (22~28°C / 30~60%RH)
Cleaning Frequency Every 10~25 boards

Storage & Handling

Storage Temp 0~10°C (Refrigerated)
Shelf Life 6 months refrigerated / 1 month room temp
Pre-use Warm-up ≥4 hours (to room temp)
Mixing Time Manual 2~4 min / Machine 1~2 min
Precautions Do not freeze · Do not mix old & new paste

Environmental Compliance

Flux Type ROL0 (IPC J-STD-004B)
Halogen Content None added (EN 14582)
RoHS 2011/65/EU Compliant
REACH SVHC List Compliant

Reliability Tests

Surface Insulation Resistance PASS (IPC J-STD-004B)
Solder Ball Test Acceptable
Slump Test PASS (IPC J-STD-005A)
Spreadability PASS (JIS Z 3197)

Packaging

Standard (500±2) g/jar
Custom Syringe dispensing / other specs upon request
Alloy Customization Other alloys & powder sizes (T3~T5) available

Recommended Reflow Profile

Peak Temperature 235~250°C (SAC Alloy)
Zone Profile Preheat 150~200°C · Soak 200~217°C · Above liquidus 30~60s · Cooling 2~4°C/s
Ramp Rate 1~2°C/s
Cooling Rate 2~4°C/s
Delta-T Control ΔT ≤ ±5°C

Related Products

Explore more solder paste products

SACMN High-Reliability Solder Paste

SACMN High-Reliability Solder Paste

Core Product · SAC305 Replacement

 SAC105 Lead-Free Solder Paste

SAC105 Lead-Free Solder Paste

Ultra-Low-Silver Economy

 Low-Temperature Lead-Free Solder Paste

Low-Temperature Lead-Free Solder Paste

Ideal for Heat-Sensitive Components